MCPP GAS-FILLED PACKAGING METALIZING SUBSTRATE FILM

Product profile and features

This product belongs to a kind of metalizing substrate. In comparision with the general purpose MCPP metalizing substrate, the product possess outstanding advantage such as  more excellent heat sealing strength, lower initiative sealing temperature , much broader sealing temperature range and so on.


Category: CPP casting film 

Parameter:

Process: Three-layer co-extrusion

Width: 2500mm

Thickness:   20~40um

Quality standard: GB\T27740-2011

Characteristic

               *Excellent aluminium bonding strength

              *Lower sealing temperature, much broader heat sealing temperature range

              *Excellent heat sealing strength 

              *Excellent gloss, transparency and stiffness

After vacuum aluminizing, it is laminated with BOPP, BOPA, BOPET and other materials for bag making, mainly used for some puffed food packaging, such as potato chips packaging, etc. 

 

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