MCPP LOW TEMPERATURE LOW FRICTION METALIZING SUBSTRATE FILM

Product profile and features

Category: CPP casting film

Parameter:

Process: Three-layer co-extrusion

Width: 2500mm

Thickness:   20~40um

Quality standard: GB\T27740-2011

 

The friction coefficient of the ordinary metalizing substrate film is about 0.75; While the friction coefficient of this film can be controlled at around 0.30-0.50  by addition of modified auxiliaries  without affecting the surface tension  and metalizing bonding strength to meet the requirements of automatic high speed packaging.   

 

Characteristic:

 

                 *Low sealing temperature

                 *Low friction coefficient

                 *Suitable for automatic high speed packaging

                 *Good printing adaptability, less odour

 

After vacuum aluminizing, it is laminated with BOPP, BOPA, BOPET and other materials for bag making,mainly used in high-speed bags making, small packaging products.

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